Update 10-14-1998

Semi-Annual Review meeting in Boston

The Fall SiWEDS Review meeting will be in Boston right after the ECS Topical Symposium on High Purity Silicon. We will start with a dinner party the evening of Wed. Nov. 4 hosted by Kim Kimerling at the MIT Faculty Club.

The actual technical review meeting will be on Thursday. November 5 at MIT's Stratton Student Center, 3rd floor, Mezzanine Lounge. Fran Page (MIT) will manage the logistics of the meeting.

The MIT Faculty Club, as well as the Stratton Student Center, is easily accessibly from the Sheraton Prudential by taxi (approx. $5-$8) or the MBTA (Boston subway and above ground transportation system, for one or two dollars). More detailed information can be find at the Web-site of MIT's Materials Processing Center http://web.mit.edu/mpc/www/. Click on "SiWEDS Semi-Annual Review Meeting" and you will have access to the Meeting Agenda, Workshop Registration Form, MIT Map and Hotel information. Please submit or fax the completed Workshop Registration Form as soon as possible to Fran Page.

This Review meeting will generally, emphasize Surface Contamination and Metrology Issues, since last Spring the meeting was heavily into Bulk Effects.

In case you would like to invite special guests or speakers inform Kim Kimerling <lckim@mit.edu> or George Rozgonyi <rozgonyi@ncsu.edu>.

 

 

SiWEDS Semi-Annual Review Meeting

Wafer Surface Preparation Program

November 4-5, 1998
Attendance by Invitation Only

PRELIMINARY AGENDA

Wednesday, November 4
MIT Faculty Club
(In case of emergency, call (617) 253-2049)
Sloan Bldg. E52, 50 Memorial Drive, Cambridge, MA

5:30 pm

Informal dinner of company, faculty, and student attendees. Poster session.

Thursday, November 5
MIT Student Center, Mezzanine Lounge, 3rd Floor
(In case of emergency, call (617) 253-3227)
Bldg. W20, 84 Massachusetts Avenue, Cambridge, MA

8:30-8:40 am

WELCOME:
Prof. Lionel C. Kimerling, MIT

8:40-8:50

SiWEDS Update and Meeting Challenge
Prof. George Rozgonyi, North Carolina State University

8:50-9:00

Starting Materials Update for the NTRS
(Huff)
   

Surface Preparation Perspective from the Wafer Supplier

9:00-9:20

In-line ICPMS at MEMC
(Shive)
   

9:20-9:40

TBA

9:40-10:00

TBA

SiWEDS Surface Preparation Research Review

10:00-10:20 *

Overview of the SiWEDS and MIT Surface Preparation Program
Prof. Lionel C. Kimerling, MIT

10:20-10:40

BREAK

10:40-11:00 *

Surface Preparation Simulation and Optimization at the University of Arizona
Prof. Harold Parks, University of Arizona

11:00-11:20 *

Surface Preparation Chemistry Research at Stanford
Prof. Chiarello, Stanford University
   

11:20-11:30

Trace Copper Deposition from Aqueous Fluoride Solutions
Prof. Takayuki Homma, Waseda University (Japan)

Panel Discussion

11:30-12:30 pm

A SiWEDS Roadmap for Wafer Surface Preparation: Processes, Properties, and Metrology
(morning speakers)

12:00-1:30 pm

Lunch and Breakout Sessions
SiWEDS Companies: MIT Student Center, Mezzanine Lounge
Universities: MIT Student Center, Twenty Chimneys

Wafer Inspection and Surface Metrology Vendors
MIT Student Center, Mezzanine Lounge

1:30-1:50

A Non-Destructive Technique for Measuring Epi Layer Resistivity Profiles (1:30-1:40) and
A Novel "Lifetime" Technique for Characterizing Silicon Surfaces (1:40-1:50)
Charlie Kohn, SemiTest, Inc.

1:50-2:10

OSDA (Optical Shallow Devect Analyzer) Measurement of Near Surface Microdefects
Hideo Naito, Assistant Director, Hitachi Scientific Instruments

SiWEDS Research Review

2:10-2:25 *

Epi Layer Characterization
Dr. Dieter Schroder, Arizona State University

2:25-2:50 *

Metrology for Surface Preparation at the University of South Florida
Professor Worth Henley, University of South Florida

2:50-3:05 *

Overview of the SiWEDS and UC Berkeley Gettering Programs
Prof. Eicke Weber, University of California at Berkeley

3:05-3:20 *

Bulk Microdefects at North Carolina State University
Prof. George Rozgonyi, North Carolina State University

3:20-3:30

BREAK

3:30-4:00

Breakout Sessions
SiWEDS Companies, faculty, students

4:00-4:30

Wrap-Up/Adjourn

Note * : Industry Representatives, please complete feed-back form.