SISPAD 2021 CONFERENCE
Dr. William Vandenberghe had the honor of being the general chair of the 2021 IEEE International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2021). The conference was held September 27-29 in a hybrid format with an on-site component at the Hilton Anatole Hotel in Dallas, live presentations over Zoom, and recorded presentations.
The SISPAD conference series is the leading international forum dedicated to the presentation and discussion of recent advances in semiconductor processes, devices, and circuit simulation, as well as their applications to advanced and emerging semiconductor devices. SISPAD 2021 marks the 26th edition of the SISPAD series, which has taken place every September in the United States, Japan, and Europe in alternating fashion. The first SISPAD conference in 1996, in turn, was held as the successor to three preceding conferences: NUPAD – The International Workshop on Numerical Modeling of Processes and Devices, held in the United States; VPAD – The International Workshop on VLSI Process and Device Modeling, held in Japan; and SISDEP – The International Conference on Simulation of Semiconductor Devices and Processes, held in Europe.
This year’s conference program included 4 plenary talks, 7 invited talks, and 63 contributed talks. These presentations were distributed over 2.5 days within 17 sessions, including 3 morning plenary sessions and one evening plenary session. We had a total of 152 participants with 21 on-site participants. Vandenberghe said,“Organizing the conference proved particularly challenging due to COVID-19 but we proved that the time for virtual-only conferences is over. The help of many was needed to make this hybrid conference possible but I want to give special thanks to my group members who assisted, Dr. Quevedo for his support, and the materials science and engineering department staff. Looking forward, as this year’s IEEE Semiconductor Interface Specialists Conference (SISC) technical chair, I welcome everyone to San Diego this December for a hybrid conference.”